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US LASER CORP: Product Catalog
Motion Control
High Speed Galvanometer Beam Delivery
U.S. Laser offers a 2 axis beam delivery system based on high speed galvanometer motors. The package includes galvanometers, mirrors, flat field lens assembly, support structure, as well as drivers and amplifiers. Each galvanometer is positional driven by a customer supplied +/- 10 vdc signal. Custom drive software is available. For scanning systems for use at wavelengths other than 1064 nm, contact sales department.
Related Products:
Laser Marking Systems
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4" Field |
6" Field |
12" Field |
| Effective Focal Length |
165 mm |
255 mm |
350 mm |
| Nominal Working Distance |
205 mm |
300 mm |
390 mm |
| Maximum Beam Diameter |
10 mm |
12 mm |
15 mm |
| Spot Size With Max TEMoo Beam (1064 nm) *see Note |
23 microns |
29 microns |
32 microns |
*Note: To obtain spot sizes with higher order multimode beams, multiply number shown by laser system M2.
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| Part No. |
Description |
| N1050-1 |
2 axis galvanometer beam delivery package with 4" field |
| N1050-2 |
2 axis galvanometer beam delivery package with 6" field |
| N1050-3 |
2 axis galvanometer beam delivery package with 12" field |
Moving Beam Systems
U.S. Laser offers a line of overhead optics moving beam systems. Essentially, the systems are precision X- Y tables which are specially designed to be used on laser systems to accurately move the beam over a fixed workpiece. Standard systems have travel distances of 6" X 6" , but larger systems are available on special order. Drive motors may be either stepper or D.C. drive, and are available with linear encoders. Other available options include motor drives and control software, as well as coaxial CCTV systems. To determine the system most appropriate for your needs, please contact the U.S. Laser sales department.
Related Products:
Laser Systems
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X-Y Tables
These tables are used to accurately position and move the workpiece under a fixed laser beam. They are available in either stepper motor or D.C. drive versions, and in sizes 4" x 4" and larger. Typical stepper motor tables are programmable in .001" increments, while more precise D.C. drive versions are available with accuracies of 1 µm and better. U.S. Laser also offers motor drives and computer programmable motion control software. Contact the U.S. Laser sales department to discuss your needs.
Related Products:
Laser Systems
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Workpiece Holding Plates
U.S. Laser workplates are designed to securely hold parts by mechanical clamping during laser processing operations. Specifically designed for flat substrates, such as solar cells, silicon wafers, and alumina plates, they can easily be adapted to other uses. Various sizes and shapes are available to accommodate the wide rage of substrate configurations. For vacuum hold-down fixtures, see the vacuum chuck section of this catalog. Please contact our sales department discuss your work holding needs, perhaps we can help.
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Vacuum Chucks
U.S. Laser vacuum chucks are holding fixtures which use the vacuum force, rather than mechanical clamping, to maintain part positioning during laser processing. Many different sizes, shapes and configurations are available. Specifically designed for flat substrates, such as solar cells, silicon wafers, and alumina plates, they can easily be adapted to other uses. Please contact our sales department to discuss your work holding needs, perhaps we can help.
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Rotary Chucks
Rotary chucks are used to rotate a circular part under a fixed or moving laser beam. Rotating speed may be controlled by either a variable speed control, or may be interfaced to an external computer system for programmable speed control. Systems are available with either D.C drive or stepper motors, and will accommodate parts from 1 mm to > 35 mm diameter. These chucks are especially popular for use with laser marking systems when it is desirable to mark on the O.D. of a circular part. For further information, please contact the U.S. Laser sales department.
Related Products:
Laser Systems
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Wafer Handling System
Wafer handling systems are used to automatically load and unload silicon wafers for laser processing. Wafers up to 8" diameter are cassette loaded into the machine. The system then automatically picks up the wafer from the cassette and positions it on the turntable. The wafer is then rotated and repositioned until it is centered. Once the wafer is centered, the system can be programmed to rotate the wafer to the desired orientation for laser processing. After the processing is complete, the wafer is downloaded to the cassette, and another wafer is retrieved until the entire cassette has been processed. All necessary hardware and software are included with the package.
Related Products:
Laser Systems
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